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 defining a degree of excellence
HIGH SPEED LAN MAGNETICS
960019B * Designed for use with Microlinear ML6692/6694/6698 PHY transceivers in either 10/100 Mbps or 100 Mbps applications * Dual, 2-port designs offer highest degree of performance, board space and cost efficiency * 40 pin low profile, surface mount packaging, rated to 225C peak IR reflow temperature * 2000 Vrms isolation
ELECTRICALS AT 25C
Part No. Insertion Loss (dB) Typ 1MHz-100MHz Return Loss (dB) Min 1MHz-30MHz Return Loss (dB) Min 30MHz-60MHz Return Loss (dB) Min 60MHz-80MHz Crosstalk (dB) Min 1MHz-100MHz Common to Diff Mode Rej (dB) Min 30MHz 100MHz Common to Common Mode Rej (dB) Min 30MHz 100MHz Schematic
S558-5999-92 S558-5999-93
-1.0 -1.0
-16 -16
16-20log(f/30MHz) 16-20log(f/30MHz)
-10 -10
-35 -35
-50 -50
-40 -40
-50 -50
-40 -40
A B
SCHEMATICS
A B
MECHANICAL
Specifications subject to change without notice.
Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302 * Tel: 201-432-0463 * Fax: 201-432-9542 * E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
defining a degree of excellence
HIGH SPEED LAN MAGNETICS
960019B
APPLICATION CIRCUIT
APPLICATION NOTES
* These Bel part types have been designed for use in 100 Mbps or 10/100 Mbps data transmission systems over category 5 UTP/STP cable. Each Bel part type provides superior EMI noise suppression, high voltage isolation, wave shaping and fast, but controlled rise times. All parts meet IEEE 802.3 standards, which includes 350H OCL (inductance) when 8mA of DC bias is applied. * These part types are recommended for use with Microlinear ML6692/6694/6698 PHY transceivers. These Bel dual, 2port solutions provide a cost effective design solution for multi-port repeater and switch applications with no performance degradation versus similar single port solutions. * Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each part is optically inspected to meet rigid coplanarity requirements.
Corporate Office Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302-4496 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: BelFuse@belfuse.com Internet: http://www.belfuse.com Far East Office Bel Fuse Ltd. 8F/8 Luk Hop Street San Po Kong Kowloon, Hong Kong Tel: 852-2328-5515 Fax: 852-2352-3706 European Office Bel Fuse Europe Ltd. Preston Technology Management Centre Marsh Lane, Preston PR1 8UD Lancashire, U.K. Tel: 44-1772-556601 Fax: 44-1772-888366


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